CXMT begins low‑volume HBM3E production, targets 2027 expansion

CXMT started the pilot production

China’s CXMT has started limited production of HBM3E high‑bandwidth memory chips, with plans to scale up manufacturing in 2027. The initiative marks the first step in CXMT’s effort to compete in the advanced memory segment dominated by Korean and U. S. firms.

The company began low‑volume manufacturing earlier this year, focusing on meeting early demand from select customers. CXMT noted the pilot run will test yield and reliability before expanding output. Industry analysts say the move could narrow the gap with SK Hynix and Micron. The HBM3E format offers higher bandwidth, which is essential for training large AI models.

CXMT started the pilot production at its Chengdu facility, delivering a modest batch of HBM3E modules. The initial run aims to validate the manufacturing process for future high‑volume output. If successful, the 2027 expansion could allow CXMT to supply major AI chip makers with domestically produced memory. CXMT’s Chengdu plant has been upgraded with advanced lithography tools to support the new memory process. If the pilot meets performance targets, volume could rise to millions of chips annually by 2027. The expansion plan includes building a dedicated HBM3E production line at a new facility in Shanghai.

Successful scaling could strengthen China’s position in AI hardware supply chains and reduce reliance on imported HBM3E. It may also accelerate China’s efforts to become self‑sufficient in advanced semiconductor components. Analysts expect the move to influence pricing trends and accelerate adoption of next‑generation AI solutions. The timeline also aligns with China’s five‑year plan for semiconductor development.

Frequently Asked Questions

When did CXMT start HBM3E production? CXMT began low‑volume HBM3E production earlier this year. The exact date was not disclosed.

What is the planned capacity increase for 2027? CXMT aims to raise output several fold, targeting full‑scale manufacturing to meet growing AI accelerator demand. The expansion will focus on high‑volume production to serve domestic and international customers.

How does this development affect China’s semiconductor self‑sufficiency? Increased domestic HBM3E supply can lessen dependence on imports, supporting China’s broader chip self‑sufficiency goals. It also positions local firms to compete more effectively in global markets.